Semiconductor Advanced...
John H Lau
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Antenna-In-Package Technology...
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Fundamentals of Device and...
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Mems Packaging
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3D IC Integration and...
John Lau
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Adhesion in Microelectronics
K L Mittal,
Tanweer Ahsan
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Mems: Fundamental Technology...
Vikas Choudhary (Editor),
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Modeling and Simulation for...
Shen Liu,
Yong Liu
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Semiconductor Packaging:...
Andrea Chen,
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3D IC Stacking Technology
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Portable Consumer Electronics...
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Introduction to Microsystem...
Yufeng Jin,
Zhiping Wang
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Advanced MEMS Packaging
John H Lau,
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RF and Microwave...
Ken Kuang (Editor),
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Mems and Microsystems: Design...
Tai-Ran Hsu
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Physical Design Essentials:...
Khosrow Golshan
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System on Package:...
Rao Tummala
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Integrated Circuit Packaging,...
William Greig
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Quantum-Well Laser Array...
Jens W Tomm,
Juan Jiménez
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Advanced Electronic Packaging
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Mems/Moem Packaging: Concepts...
Ken Gilleo
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Microelectronic Packaging
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IC Component Sockets
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Area Array Packaging Processes
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