Semiconductor Advanced...
John H. Lau
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Semiconductor Advanced...
John H Lau
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Antenna-In-Package Technology...
Duixian Liu,
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Fundamentals of Device and...
Rao Tummala
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Introduction to Microsystem...
Yufeng Jin,
Zhiping Wang
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Mems Packaging
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Yu-ting Cheng (Editor)
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Semiconductor Packaging:...
Andrea Chen,
Randy Hsiao-Yu Lo
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MEMS: Fundamental Technology...
Vikas Choudhary (Editor),
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3D IC Integration and...
John Lau
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Adhesion in Microelectronics
K L Mittal,
Tanweer Ahsan
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RF and Microwave...
Ken Kuang (Editor),
Franklin Kim (Editor)
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Foldable Flex and Thinned...
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Mems: Fundamental Technology...
Vikas Choudhary (Editor),
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Microelectronic Packaging: A...
A H Agajanian
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Microelectronic...
G G Harman (Editor),
Pavel Mach (Editor)
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Microelectronics Packaging...
R R Tummala,
Eugene J Rymaszewski
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The Simulation of...
Gerard Kelly
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Thermal Stress and Strain in...
John Lau (Editor)
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Modeling and Simulation for...
Shen Liu,
Yong Liu
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Semiconductor Packaging:...
Andrea Chen,
Randy Hsiao-Yu Lo
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3D IC Stacking Technology
Banqiu Wu,
Ajay Kumar
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Integrated Circuit Packaging,...
William Greig
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Portable Consumer Electronics...
Sridhar Canumalla,
Puligandla Viswanadham
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Introduction to Microsystem...
Yufeng Jin,
Zhiping Wang
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