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Fundamentals of...
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Fundamentals of Microsystems...
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3D IC Integration and...
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Chip Scale Package: Design,...
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3D IC Stacking Technology
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Optoelectronic Packaging
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Plastic-Encapsulated...
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Thermal stress and strain in...
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Portable Consumer Electronics...
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System on Package:...
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Advanced Electronic Packaging...
William D Brown (Editor)
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RF Measurements of Die and...
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Mems and Microsystems: Design...
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Integrated Circuit Packaging,...
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Microelectronics Packaging...
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Adhesion in Microelectronics
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Reliability of Electronic...
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Flip Chip Technologies
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