This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / ...
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This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings
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Add this copy of Adhesion in Microelectronics to cart. $169.44, very good condition, Sold by ThriftBooks-Reno rated 5.0 out of 5 stars, ships from Reno, NV, UNITED STATES, published 2014 by Wiley-Scrivener.
Add this copy of Adhesion in Microelectronics to cart. $169.49, like new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2014 by Wiley-Scrivener.
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Fine. Sewn binding. Paper over boards. 368 p. Contains: Illustrations, black & white, Line drawings, black & white, Tables, black & white, Figures. Adhesion and Adhesives: Fundamental and Applied Aspects. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of Adhesion in Microelectronics to cart. $211.54, new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2014 by Wiley-Scrivener.
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Seller's Description:
New. Sewn binding. Paper over boards. 368 p. Contains: Illustrations, black & white, Line drawings, black & white, Tables, black & white, Figures. Adhesion and Adhesives: Fundamental and Applied Aspects. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of Adhesion in Microelectronics to cart. $211.55, new condition, Sold by booksXpress, ships from Bayonne, NJ, UNITED STATES, published 2014 by Wiley-Scrivener.
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Seller's Description:
New. Sewn binding. Paper over boards. 368 p. Contains: Illustrations, black & white, Line drawings, black & white, Tables, black & white, Figures. Adhesion and Adhesives: Fundamental and Applied Aspects.
