This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
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This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
Read Less
Add this copy of Area Array Packaging Processes: for Bga, Flip Chip, and to cart. $44.77, like new condition, Sold by Solomon's Mine Books rated 5.0 out of 5 stars, ships from Howard, PA, UNITED STATES, published 2003 by McGraw-Hill Professional.
Add this copy of Area Array Packaging Processes to cart. $84.22, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Hialeah, FL, UNITED STATES, published 2003 by McGraw-Hill.
Add this copy of Area Array Packaging Processes to cart. $137.15, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2003 by McGraw-Hill Professional.
Add this copy of Area Array Packaging Processes to cart. $160.85, new condition, Sold by Ria Christie Books rated 5.0 out of 5 stars, ships from Uxbridge, MIDDLESEX, UNITED KINGDOM, published 2003 by McGraw-Hill Professional.
Add this copy of Area Array Packaging Processes to cart. $174.54, new condition, Sold by Booksplease rated 4.0 out of 5 stars, ships from Southport, MERSEYSIDE, UNITED KINGDOM, published 2003 by McGraw-Hill Professional.
