This engineering reference covers the most important assembly processes in modern electronic packaging. It includes flip chip assembly and processes, die-attach, and BGA and CSP rework.
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This engineering reference covers the most important assembly processes in modern electronic packaging. It includes flip chip assembly and processes, die-attach, and BGA and CSP rework.
Read Less
Add this copy of Area Array Packaging Processes: for Bga, Flip Chip, and to cart. $37.50, good condition, Sold by Second Story Books rated 4.0 out of 5 stars, ships from Rockville, MD, UNITED STATES, published 2004 by The McGraw-Hill Companies, Inc.
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Seller's Description:
Book. Octavo; VG-; dark blue spine with white text; ex-library; first thus; cloth exterior has slight handling wear; ex-library sticker to spine; small sticker to rear; light wear to corners; strong binding; no jacket; text block exterior edges have light wear; few ex-library markings to endpapers; interior good otherwise; illustrated; pp 260. 1365311. FP New Rockville Stock.
Add this copy of Area Array Packaging Processes: for Bga, Flip Chip, and to cart. $44.77, like new condition, Sold by Solomon's Mine Books rated 5.0 out of 5 stars, ships from Howard, PA, UNITED STATES, published 2003 by McGraw-Hill Professional.
Add this copy of Area Array Packaging Processes: for Bga, Flip Chip, and to cart. $48.99, good condition, Sold by Goodwill of Silicon Valley rated 5.0 out of 5 stars, ships from San Jose, CA, UNITED STATES, published 2003 by McGraw-Hill Professional.
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Seller's Description:
Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can included some highlighting and writing page and cover creases as well as other types visible wear.
Add this copy of Area Array Packaging Processes to cart. $84.22, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Hialeah, FL, UNITED STATES, published 2003 by McGraw-Hill.
Add this copy of Area Array Packaging Processes: for Bga, Flip Chip, and to cart. $103.06, new condition, Sold by discount_scientific_books rated 5.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 2003 by McGraw-Hill Professional Publishing.
Add this copy of Area Array Packaging Processes: for Bga, Flip Chip, and to cart. $112.86, new condition, Sold by discount_scientific_books rated 5.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 2003 by McGraw-Hill Professional Publishing.
Add this copy of Area Array Packaging Processes to cart. $126.77, new condition, Sold by Media Smart rated 4.0 out of 5 stars, ships from Hawthorne, CA, UNITED STATES, published 2003 by The McGraw-Hill Company.
Add this copy of Area Array Packaging Processes to cart. $137.15, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2003 by McGraw-Hill Professional.
