The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers ...
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The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories.
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Add this copy of Advances in Thermal Modelling of Electronic Components to cart. $115.64, new condition, Sold by Paperbackshop rated 4.0 out of 5 stars, ships from Bensenville, IL, UNITED STATES, published 1990 by American Society of Mechanical Engineers.
Add this copy of Advances in Thermal Modeling of Electronic Components to cart. $131.21, new condition, Sold by Booksplease rated 4.0 out of 5 stars, ships from Southport, MERSEYSIDE, UNITED KINGDOM, published 1990 by American Society of Mechanical Engineers.
Publisher:
American Society of Mechanical Engineers
Published:
1990
Language:
English
Alibris ID:
17966252926
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Seller's Description:
New. Sewn binding. Cloth over boards. 437 p. Contains: Tables, black & white, Figures. Advances in Thermal Modeling of Electronic Components and Systems, 2.
Add this copy of Advances in Thermal Modeling of Electronic Components to cart. $147.74, new condition, Sold by Revaluation Books rated 4.0 out of 5 stars, ships from Exeter, DEVON, UNITED KINGDOM, published 1990 by Amer Society of Mechanical.
Add this copy of Advances in Thermal Modeling of Electronic Components to cart. $152.06, new condition, Sold by Media Smart rated 3.0 out of 5 stars, ships from Hawthorne, CA, UNITED STATES, published 1993 by American Society of Mechanical Engineers ASME.
Add this copy of Advances in Thermal Modelling of Electronic Components to cart. $204.53, new condition, Sold by Kennys.ie rated 4.0 out of 5 stars, ships from Galway, IRELAND, published 1990 by American Society of Mechanical Engineers.
