The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers ...
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The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories.
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Add this copy of Advances in Thermal Modeling of Electronic Components to cart. $13.50, Sold by Crossroad Books rated 4.0 out of 5 stars, ships from Eau Claire, WI, UNITED STATES, published 1990 by American Society of Mechanical Engineers.
Publisher:
American Society of Mechanical Engineers
Published:
1990
Language:
English
Alibris ID:
13839607153
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Seller's Description:
With no dust jacket. 0791800156. Volume 2. Ex-Corporate Library copy; with typical markings. Library label on front board and on spine tail. Light bumping on spine extremities and board corners. Pages clean, but for library markings.; TEH22A; 437 pages; Ex-Library.
Add this copy of Advances in Thermal Modeling of Electronic Components to cart. $15.31, good condition, Sold by Wonder Book - Member ABAA/ILAB rated 5.0 out of 5 stars, ships from Frederick, MD, UNITED STATES, published 1990 by American Society of Mechanical Engineers.
Publisher:
American Society of Mechanical Engineers
Published:
1990
Language:
English
Alibris ID:
18132751786
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Seller's Description:
Good. Good condition. Volume 2. A copy that has been read but remains intact. May contain markings such as bookplates, stamps, limited notes and highlighting, or a few light stains.
Add this copy of Advances in Thermal Modeling of Electronic Components to cart. $65.00, like new condition, Sold by Fair Price Book Sales rated 2.0 out of 5 stars, ships from Fairhaven, MA, UNITED STATES, published 1990 by American Society of Mechanical Engineers.
Publisher:
American Society of Mechanical Engineers
Published:
1990
Language:
English
Alibris ID:
17744248238
Shipping Options:
Standard Shipping: $4.99
Trackable Expedited: $9.99
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Seller's Description:
Fine. Sewn binding. Cloth over boards. 437 p. Contains: Tables, black & white, Figures. Advances in Thermal Modeling of Electronic Components and Systems, 2. Audience: General/trade. As new condition. Appears to be unopened. No markings in or on the book.
