A powerful methodology for producing superior thermal performanceat low cost with minimum added mass . . . Here is the only available comprehensive treatment of the designand analysis of heat sinks. It provides all the theoretical andpractical information necessary to successfully design and/orselect cost-effective heat sinks for electronic equipment. Thepresentation includes detailed explanations of the governing heattransfer phenomena, complete coverage of thermal modeling tools forgeometrically complex fin structures, ...
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A powerful methodology for producing superior thermal performanceat low cost with minimum added mass . . . Here is the only available comprehensive treatment of the designand analysis of heat sinks. It provides all the theoretical andpractical information necessary to successfully design and/orselect cost-effective heat sinks for electronic equipment. Thepresentation includes detailed explanations of the governing heattransfer phenomena, complete coverage of thermal modeling tools forgeometrically complex fin structures, and extensive discussion onrecognizing thermal optimization opportunities. Other topics covered include: * Fundamentals of heat transfer * Thermal modeling of electronic packages * Mathematical tools for heat-sink analysis and design * Prevailing thermal transport processes * Models for a variety of fin geometries * Simple "transfer function" relations for single fin, cascadedfin, and fin array heat sinks * Thermal characterization and optimization of plate-fin heatsinks Completely self-contained and filled with valuable information notavailable from any other single source, Design and Analysis of HeatSinks is both a superior reference for accomplished thermalspecialists and an excellent textbook for graduate courses inadvanced thermal applications for mechanical engineering students.This book can also serve as a text in thermal science for studentsof electrical engineering.
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Add this copy of Design and Analysis of Heat Sinks to cart. $109.95, good condition, Sold by Salish Sea Books rated 5.0 out of 5 stars, ships from Bellingham, WA, UNITED STATES, published 1995 by Wiley-Interscience Publishing.
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Good++; Hardcover; Covers are still glossy; Unblemished textblock edges; Name inside the front cover; Highlighting to about 10 pages, otherwise text pages are all clean and unmarked; The binding is excellent with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5"-9.75" tall); 1.6 lbs; Light blue covers with title in black lettering; 1995, Wiley-Interscience Publishing; 424 pages; "Design and Analysis of Heat Sinks, " by Allan D. Kraus & Avram Bar-Cohen.
Add this copy of Design and Analysis of Heat Sinks to cart. $110.89, very good condition, Sold by ThriftBooks-Dallas rated 5.0 out of 5 stars, ships from Dallas, TX, UNITED STATES, published 1995 by Wiley-Interscience.
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Very Good. Size: 6x1x9; Ex-Library hardcover in very nice condition with the usual markings and attachments. Except for library markings, interior clean and unmarked. Tight binding.
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Very good. Very clean hardcover. no marks. clean text. solid binding. very light wear. ISBN matches listing FAST SHIPPING W/ CONFIRMATION. NO PRIORITY OR INTERNATIONAL ORDERS OVER 4LBs.
Add this copy of Design and Analysis of Heat Sinks to cart. $110.90, good condition, Sold by More Than Words rated 4.0 out of 5 stars, ships from Waltham, MA, UNITED STATES, published 1995 by Wiley-Interscience.
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Fine. Sewn binding. Cloth over boards. 424 p. Contains: Unspecified. Thermal Management of Microelectronic and Electronic System, 1. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
