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ISBN: 9789811201110
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9789811201110
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Encyclopedia of Packaging Materials, Processes, and Mechanics-Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set)
2019, World Scientific Publishing Comp
ISBN-13:
9789811201110
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Edition: 2019, World Scientific Publishing Comp
Hardcover,
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Details: ISBN:
9811201110
ISBN-13:
9789811201110
Publisher:
World Scientific Publishing Comp
Published:
2019
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18305218666
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Encyclopedia of Packaging Materials, Processes, and Mechanics 4 Vol Set
by Avram Bar-Cohen, Jeffrey C Suhling, Andrew A O Tay,
2019, World Scientific Publishing Co Pte Ltd
ISBN-13:
9789811201110
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Edition: 2019, World Scientific Publishing Co Pte Ltd
New
Details: ISBN:
9811201110
ISBN-13:
9789811201110
Publisher:
World Scientific Publishing Co Pte Ltd
Published:
2019
Language:
English
Alibris ID:
18223192917
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Encyclopedia of Packaging Materials, Processes, and Mechanics 4 Vol Set
by Avram Bar-Cohen, Jeffrey C Suhling, Andrew A O Tay,
2019, World Scientific Publishing Co Pte Ltd
ISBN-13:
9789811201110
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Edition: 2019, World Scientific Publishing Co Pte Ltd
New
Details: ISBN:
9811201110
ISBN-13:
9789811201110
Publisher:
World Scientific Publishing Co Pte Ltd
Published:
2019
Language:
English
Alibris ID:
18224324098
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Encyclopedia of Packaging Materials, Processes, and Mechanics-Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set)
2019, World Scientific Publishing Co Pte Ltd
ISBN-13:
9789811201110
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Edition: 2019, World Scientific Publishing Co Pte Ltd
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Details: ISBN:
9811201110
ISBN-13:
9789811201110
Publisher:
World Scientific Publishing Co Pte Ltd
Published:
2019
Language:
English
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18177632484
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Encyclopedia of Packaging Materials, Processes, and Mechanics-Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set)
2019, World Scientific Publishing Co Pte Ltd
ISBN-13:
9789811201110
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Edition: 2019, World Scientific Publishing Co Pte Ltd
Hardcover,
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Details: ISBN:
9811201110
ISBN-13:
9789811201110
Publisher:
World Scientific Publishing Co Pte Ltd
Published:
2019
Language:
English
Alibris ID:
18256317241
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Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)
by Bar-cohen, Avram (Editor-in-chief), and Suhling, Jeffrey C (Editor-in-chief), and Tay, Andrew A O (Editor-in-chief)
2019, World Scientific Publishing Co Pte Ltd
ISBN-13:
9789811201110
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Ria Christie Books
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MIDDLESEX,
UNITED KINGDOM
$1,913.99
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Add this copy of Encyclopedia Of Packaging Materials, Processes, And to cart. $1,913.99, new condition, Sold by Ria Christie Books rated 4.0 out of 5 stars, ships from Uxbridge, MIDDLESEX, UNITED KINGDOM, published 2019 by World Scientific Publishing Co Pte Ltd.
Edition: 2019, World Scientific Publishing Co Pte Ltd
Hardcover,
New
Details: ISBN:
9811201110
ISBN-13:
9789811201110
Publisher:
World Scientific Publishing Co Pte Ltd
Published:
2019
Language:
English
Alibris ID:
18301921841
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