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ISBN: 9783725814473
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3725814473 /
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9783725814473
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The 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023
by Meen, Teen--Hang (Guest editor), and Lin, Hsin-Hung (Guest editor), and Yang, Cheng-Fu (Guest editor)
2024, Mdpi AG
ISBN-13:
9783725814473
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Add this copy of The 3rd IEEE International Conference on Electronic to cart. $139.42, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2024 by Mdpi AG.
Edition: 2024, Mdpi AG
Hardcover,
New
Available Copies: 10+
Details: ISBN:
3725814473
ISBN-13:
9783725814473
Publisher:
Mdpi AG
Published:
2024
Language:
English
Alibris ID:
18055960980
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Seller's Description: New. Print on demand Sewn binding. Cloth over boards. 640 p.
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Hardcover,
New
The 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023
by Meen, Teen--Hang (Guest editor), and Lin, Hsin-Hung (Guest editor), and Yang, Cheng-Fu (Guest editor)
2024, Mdpi AG
ISBN-13:
9783725814473
See Item Details ▾
Booksplease
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Southport,
MERSEYSIDE,
UNITED KINGDOM
$209.84
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Add this copy of The 3rd IEEE International Conference on Electronic to cart. $209.84, new condition, Sold by Booksplease rated 4.0 out of 5 stars, ships from Southport, MERSEYSIDE, UNITED KINGDOM, published 2024 by Mdpi AG.
Edition: 2024, Mdpi AG
Hardcover,
New
Available Copies: 5
Details: ISBN:
3725814473
ISBN-13:
9783725814473
Publisher:
Mdpi AG
Published:
2024
Language:
English
Alibris ID:
18045386812
Shipping Options: Standard Shipping: $4.99
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description: New. Sewn binding. Cloth over boards. 640 p.
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