This book provides a comprehensive presentation of all types of HTSC and includes a broad overview on HTSC computer simulations and modeling. Especial attention is devoted to the Bi-Sr-Ca-Cu-O and Y-Ba-Cu-O families that today are the most perspective for applications. The book includes a great number of illustrations and references. The monograph is addressed to students, post-graduate students and specialists, taking part in the development, preparation and researching of new materials.
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This book provides a comprehensive presentation of all types of HTSC and includes a broad overview on HTSC computer simulations and modeling. Especial attention is devoted to the Bi-Sr-Ca-Cu-O and Y-Ba-Cu-O families that today are the most perspective for applications. The book includes a great number of illustrations and references. The monograph is addressed to students, post-graduate students and specialists, taking part in the development, preparation and researching of new materials.
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Add this copy of Microstructure and Properties of High-Temperature to cart. $39.90, new condition, Sold by Basi6 International rated 5.0 out of 5 stars, ships from Irving, TX, UNITED STATES, published 2007 by Springer.
Add this copy of Microstructure and Properties of High Temperature to cart. $80.28, new condition, Sold by Basi6 International rated 5.0 out of 5 stars, ships from Irving, TX, UNITED STATES, published 2007 by Springer.
Add this copy of Microstructure and Properties of High-Temperature to cart. $88.58, new condition, Sold by Media Smart rated 3.0 out of 5 stars, ships from Hawthorne, CA, UNITED STATES, published 2007 by Springer.
Add this copy of Microstructure and Properties of High Temperature to cart. $90.99, new condition, Sold by Basi6 International rated 5.0 out of 5 stars, ships from Irving, TX, UNITED STATES, published 2007 by Springer.
Add this copy of Microstructure and Properties of High-Temperature to cart. $91.25, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 2007 by Springer.
