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ISBN: 9783319830865
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3D Microelectronic Packaging: From Fundamentals to Applications
by Li, Yan (Editor), and Goyal, Deepak (Editor)
2018, Springer
ISBN-13:
9783319830865
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Add this copy of 3D Microelectronic Packaging: From Fundamentals to to cart. $187.87, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2018 by Springer.
Edition: 2018, Springer
Paperback,
New
Available Copies: 10+
Details: ISBN:
3319830864
ISBN-13:
9783319830865
Publisher:
Springer
Published:
2018
Language:
English
Alibris ID:
14890777604
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Seller's Description: New. Print on demand Trade paperback (US). Glued binding. 463 p. Contains: Unspecified, Illustrations, black & white, Illustrations, color. Springer Advanced Microelectronics, 57.
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Paperback,
New
3D Microelectronic Packaging: From Fundamentals to Applications
by Li, Yan (Editor), and Goyal, Deepak (Editor)
2018, Springer
ISBN-13:
9783319830865
See Item Details ▾
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Bayonne,
NJ,
USA
$207.39
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Add this copy of 3D Microelectronic Packaging: From Fundamentals to to cart. $207.39, new condition, Sold by booksXpress, ships from Bayonne, NJ, UNITED STATES, published 2018 by Springer.
Edition: 2018, Springer
Paperback,
New
Available Copies: 10+
Details: ISBN:
3319830864
ISBN-13:
9783319830865
Publisher:
Springer
Published:
2018
Language:
English
Alibris ID:
17917414495
Shipping Options: Standard Shipping: $4.99
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description: New. Trade paperback (US). Glued binding. 463 p. Contains: Unspecified, Illustrations, black & white, Illustrations, color. Springer Advanced Microelectronics, 57.
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