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3D Microelectronic Packaging: From Fundamentals to Applications
by Li, Yan (Editor), and Goyal, Deepak (Editor)
2018, Springer
ISBN-13:
9783319830865
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Add this copy of 3D Microelectronic Packaging: From Fundamentals to to cart. $187.87, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2018 by Springer.
Edition: 2018, Springer
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Details: ISBN:
3319830864
ISBN-13:
9783319830865
Publisher:
Springer
Published:
2018
Language:
English
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14890777604
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Seller's Description: New. Print on demand Trade paperback (US). Glued binding. 463 p. Contains: Unspecified, Illustrations, black & white, Illustrations, color. Springer Advanced Microelectronics, 57.
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3d Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics, 57)
2018, Springer
ISBN-13:
9783319830865
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$224.84
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Add this copy of 3d Microelectronic Packaging: From Fundamentals to to cart. $224.84, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 2018 by Springer.
Edition: 2018, Springer
Paperback,
Good
Details: ISBN:
3319830864
ISBN-13:
9783319830865
Publisher:
Springer
Published:
2018
Language:
English
Alibris ID:
18142743053
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