This is an expanded and revised second edition, presenting accurate and comprehensive information about our leading thermal scientists to current and future generations. In our globalized world, most researchers in thermal analysis do not know each other in person and are not familiar with each other's achievements. This volume provides the reader with an up-to-date list of the prominent members in this community. The publication contains only living scientists. The selection is based partly on several decades of the ...
Read More
This is an expanded and revised second edition, presenting accurate and comprehensive information about our leading thermal scientists to current and future generations. In our globalized world, most researchers in thermal analysis do not know each other in person and are not familiar with each other's achievements. This volume provides the reader with an up-to-date list of the prominent members in this community. The publication contains only living scientists. The selection is based partly on several decades of the editors' personal professional experience and also partly on the opinion of the Regional Editors of the Journal of Thermal Analysis and Calorimetry.
Read Less
Add this copy of Who Is Who in Thermal Analysis and Calorimetry to cart. $148.78, like new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2014 by Springer.
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
Fine. Sewn binding. Cloth over boards. 363 p. Contains: Illustrations, black & white, Illustrations, color. Hot Topics in Thermal Analysis and Calorimetry, 10. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
