Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and ...
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Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
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Add this copy of Ceramic Interconnect Technology Handbook to cart. $199.86, like new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2007 by CRC Press.
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Fine. Sewn binding. Paper over boards. 456 p. Contains: Illustrations, black & white, Halftones, black & white, Tables, black & white. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of Ceramic Interconnect Technology Handbook to cart. $199.87, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 2007 by CRC Press.
Add this copy of Ceramic Interconnect Technology Handbook to cart. $226.43, new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2007 by CRC Press.
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
New. Sewn binding. Paper over boards. 456 p. Contains: Illustrations, black & white, Halftones, black & white, Tables, black & white. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
