Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the ...
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Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation �/LIST� Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
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Add this copy of Benefiting From Thermal and Mechanical Simulation in to cart. $65.52, good condition, Sold by Books On The Run rated 5.0 out of 5 stars, ships from Ocala, FL, UNITED STATES, published 2000 by Springer.
Add this copy of Benefiting from Thermal and Mechanical Simulation in to cart. $103.32, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2000 by Springer.
Add this copy of Benefiting from Thermal and Mechanical Simulation in to cart. $116.09, new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2000 by Springer.
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New. Sewn binding. Cloth over boards. 192 p. Contains: Unspecified. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of Benefiting from Thermal and Mechanical Simulation in to cart. $116.09, like new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2000 by Springer.
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
Fine. Sewn binding. Cloth over boards. 192 p. Contains: Unspecified. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.