Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, 2007, San Francisco, California, U.S.A.
by Lin, Qinghuang (Editor), and Ryan, E. Todd (Editor), and Wu, Wen-li (Editor)
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, 2007, San Francisco, California, U.S.A.
by Lin, Qinghuang (Editor), and Ryan, E. Todd (Editor), and Wu, Wen-li (Editor)
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro-and Nanoelectronics: Volume 990: Symposium Held April 10? 12, ...California, U.S.a. (Mrs Proceedings)
Add this copy of Materials, Processes, Integration and Reliability in to cart. $50.84, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 2014 by Cambridge University Press.
