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Through-Silicon Vias for 3D Integration

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Through-Silicon Vias for 3D Integration - Lau, John H
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This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products.

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    eBook icon EPUB eBook Through-Silicon Vias for 3d Integration

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    • Title: Through-Silicon Vias for 3d Integration by John H. Lau
    • Publisher: McGraw-Hill Professional
    • Print ISBN: 9780071785143, 0071785140
    • eText ISBN: 9780071785150
    • Edition: 2012 1st edition
    • Format: EPUB eBook
    $145.80
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