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Electronic Packaging: Design, Materials, Process, and Reliability

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Electronic Packaging: Design, Materials, Process, and Reliability - Lau, John H, and Wong, C P, and Prince, J L
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Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.

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Electronic Packaging: Design, Materials, Process, and Reliability 1998, McGraw-Hill Professional Publishing, New York, NY

ISBN-13: 9780070371354

Hardcover