This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products.
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This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products.
Read Less
Add this copy of Through-Silicon Vias for 3d Integration to cart. $64.72, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 2012 by McGraw Hill.
Add this copy of Through-Silicon Vias for 3d Integration to cart. $100.93, new condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 2012 by McGraw Hill.
Add this copy of Through-Silicon Vias for 3d Integration to cart. $111.44, new condition, Sold by discount_scientific_books rated 4.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 2012 by McGraw-Hill Companies.
Add this copy of Through-Silicon Vias for 3d Integration to cart. $112.02, new condition, Sold by Basi6 International rated 5.0 out of 5 stars, ships from Irving, TX, UNITED STATES, published 2012 by McGraw-Hill Companies.
Add this copy of Through-Silicon Vias for 3D Integration to cart. $172.96, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2012 by McGraw-Hill Companies.
Add this copy of Through-Silicon Vias (Tsv) for 3d Integration 2013 (Mh) to cart. $199.95, new condition, Sold by textsforsale rated 5.0 out of 5 stars, ships from Houston, TX, UNITED STATES, published 2012 by McGraw-Hill Companies.
