The past twenty years have seen many important advances in plastic encapsulated microelectronics (PEM) technology. Thanks to new packaging materials, improved design, increased reliability testing, and other important developments, PEMs are now perceived as a dependable and, in many cases, more cost-effective option for a wide range of electronic systems applications. Nevertheless, there continues to be a surprising dearth of authoritative references on the subject. Until now, professionals in search of detailed information ...
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The past twenty years have seen many important advances in plastic encapsulated microelectronics (PEM) technology. Thanks to new packaging materials, improved design, increased reliability testing, and other important developments, PEMs are now perceived as a dependable and, in many cases, more cost-effective option for a wide range of electronic systems applications. Nevertheless, there continues to be a surprising dearth of authoritative references on the subject. Until now, professionals in search of detailed information about the latest developments in PEM design and production have had to waste valuable time browsing through countless professional journals, monographs, and databases. For the first time between two covers, here is a comprehensive, critical review of the state of the art in PEMs and assemblies that incorporate them. The most timely book on the subject, it provides professionals with a systematic, scientific exploration of crucial technical and reliability issues concerning the manufacture and use of PEMs--with special attention focusing on environment-specific applications. Among the important topics covered in detail: Encapsulating materials--composition, shapes, and sizes Fabrication technology--with an in depth look at potential defects that can occur during each phase of production Electronic system manufacturing using PEMs--with extensive coverage of thermomechanical stress induced failures that can occur during assembly Failure mechanisms, sites, and modes Failure analysis techniques--the relative strengths and weaknesses of each type The pros and cons of current screening techniques for reliability conformance and quality improvement and the defects they can induce Current qualification and life-testing techniques and their effectiveness in simulating use conditions Plastic-Encapsulated Microelectronics is an indispensable resource for researchers and practicing mechanical and electrical engineers working in the electronics, aerospace, and automotive industries, in space agencies, or in the defense industry. The most timely and authoritative reference on the subject, Plastic- Encapsulated Microelectronics provides professionals with a systematic, scientific exploration of crucial technical and reliability issues concerning the manufacture and use of PEMs. Comprehensive in scope, it offers detailed coverage of important topics in encapsulating materials; fabrication technology; electronic system manufacturing using PEMs; failure mechanisms, sites, and modes; failure analysis techniques; current screening techniques for reliability conformance and quality; current qualification and life-testing techniques; and more: Offers a systematic critical review of the state of the art in PEM design, manufacture, reliability testing, and more Covers a wide range of issues in PEM applications with special attention given to environment-specific PEM applications Features science-based explanations of manufacturing failures--especially thermo-mechanical, stress-induced failures that can occur during assembly of PEM devices on circuit cards Explores current screening techniques and introduces a philosophy of screening based on the "physics of failure"
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Add this copy of Plastic-Encapsulated Microelectronics: Materials, to cart. $34.50, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 1995 by Wiley-Interscience.
