Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
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Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
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Add this copy of Foldable Flex and Thinned Silicon Multichip Packaging to cart. $158.08, like new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2014 by Springer-Verlag New York Inc..
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Fine. Contains: Illustrations, black & white. Emerging Technology in Advanced Packaging . XIX, 347 p. 266 illus. Intended for professional and scholarly audience. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of Foldable Flex and Thinned Silicon Multichip Packaging to cart. $159.68, new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2014 by Springer-Verlag New York Inc..
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Seller's Description:
New. Contains: Illustrations, black & white. Emerging Technology in Advanced Packaging . XIX, 347 p. 266 illus. Intended for professional and scholarly audience. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of Foldable Flex and Thinned Silicon Multichip Packaging to cart. $159.69, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2014 by Springer-Verlag New York Inc..
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New. Print on demand Contains: Illustrations, black & white. Emerging Technology in Advanced Packaging . XIX, 347 p. 266 illus. Intended for professional and scholarly audience.
Add this copy of Foldable Flex and Thinned Silicon Multichip Packaging to cart. $175.32, new condition, Sold by booksXpress, ships from Bayonne, NJ, UNITED STATES, published 2014 by Springer-Verlag New York Inc..
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Seller's Description:
New. Contains: Illustrations, black & white. Emerging Technology in Advanced Packaging . XIX, 347 p. 266 illus. Intended for professional and scholarly audience.
