Book Details
Seller
Sort
Seller Rating
Price: Low to High
Price: High to Low
Condition
Condition: Reverse
Pub Date
Pub Date: Reverse
Sellers Near Me
Hardcover,
New
2018, Springer
ISBN-13:
9789811088834
See Item Details ▾
Alibris
BEST
NV, USA
$150.29
Add to Cart
Add this copy of Fan-Out Wafer-Level Packaging to cart. $150.29, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2018 by Springer.
Edition: 2018, Springer
Hardcover,
New
Available Copies: 10+
Details: ISBN:
9811088837
ISBN-13:
9789811088834
Pages:
303
Edition:
2018 edition
Publisher:
Springer
Published:
2018
Language:
English
Alibris ID:
14648425699
Shipping Options: Standard Shipping: $4.99
Trackable Expedited: $9.99
Two Day Air: $29.99
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description: New. Print on demand Sewn binding. Cloth over boards. 303 p. Contains: Unspecified, Illustrations, black & white, Illustrations, color, Tables, color.
Hide Details ▴
ISBN-13: 9789811088834
2018 edition
Hardcover
ISBN-13: 9789811342660
Trade paperback
All Editions of Fan-Out Wafer-Level Packaging
