With their unique electrical and thermal properties, ceramics are ideal for application in a wide variety of electronic systems and products. However, they are relegated either to a single chapter in electronic packaging books or to older, dated treatments. Offering much more than a discourse on the materials science behind these technologies, this book offers comprehensive, up-to-date coverage of all aspects of ceramic interconnect technologies in electronics and electronic packaging. The authors authoritatively discuss ...
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With their unique electrical and thermal properties, ceramics are ideal for application in a wide variety of electronic systems and products. However, they are relegated either to a single chapter in electronic packaging books or to older, dated treatments. Offering much more than a discourse on the materials science behind these technologies, this book offers comprehensive, up-to-date coverage of all aspects of ceramic interconnect technologies in electronics and electronic packaging. The authors authoritatively discuss trends in electronic packaging, electrical design, simulation, and testing, ceramic materials, and the various types of ceramic interconnects, devices, and applications.
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New. Sewn binding. Paper over boards. 456 p. Contains: Illustrations, black & white, Halftones, black & white, Tables, black & white. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of Ceramic Interconnect Technology Handbook to cart. $229.21, new condition, Sold by Paperbackshop rated 4.0 out of 5 stars, ships from Bensenville, IL, UNITED STATES, published 2007 by CRC Press.