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An comprehensive guide to advanced MEMS packaging methods This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging. Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenging problems created by the ever-increasing interests in MEMS devices and packaging. This authoritative guide is ideal for anyone who needs to choose a reliable, creative, high-performance, ...

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    • Title: Advanced Mems Packaging by John H. Lau; Cheng Kuo Lee; C. S. Premachandran; Yu Aibin
    • Publisher: McGraw-Hill Professional
    • Print ISBN: 9780071626231, 0071626239
    • eText ISBN: 9780071627924
    • Edition: 2009 1st edition
    • Format: EPUB eBook
    $161.10
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