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9780442013530
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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
by Hwang, Jennie
1992, Springer
ISBN-13:
9780442013530
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Add this copy of Solder Paste in Electronics Packaging: Technology and to cart. $103.32, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 1992 by Springer.
Edition: 1992, Springer
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Available Copies: 10+
Details: ISBN:
0442013531
ISBN-13:
9780442013530
Edition:
Revised edition
Publisher:
Springer
Published:
1992
Language:
English
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11629546353
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Seller's Description: New. Print on demand Trade paperback (US). Glued binding. 456 p. Contains: Illustrations, black & white.
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Paperback,
New
Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
by Hwang, Jennie
1992, Springer
ISBN-13:
9780442013530
See Item Details ▾
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Add this copy of Solder Paste in Electronics Packaging: Technology and to cart. $140.70, new condition, Sold by Ria Christie Books rated 5.0 out of 5 stars, ships from Uxbridge, MIDDLESEX, UNITED KINGDOM, published 1992 by Springer.
Edition: 1992, Springer
Paperback,
New
Available Copies: 10+
Details: ISBN:
0442013531
ISBN-13:
9780442013530
Edition:
Revised edition
Publisher:
Springer
Published:
1992
Language:
English
Alibris ID:
17382802787
Shipping Options: Standard Shipping: $4.99
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Seller's Description: New. Trade paperback (US). Glued binding. 456 p. Contains: Illustrations, black & white.
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