Jacopo Iannacci

Jacopo Iannacci (Senior Member of the IEEE) was born in Bologna, Italy in 1977. He received his MSc (Laurea) degree in electronics engineering in 2003 and his PhD in information and telecommunications technology in 2007, both from the University of Bologna, Italy. He received Habilitation as Full Professor in Electronics from the Italian Ministry of University and Research (MUR), in 2021. He worked in 2005 and 2006 as visiting researcher at the DIMES Technology Center (currently Else Kooi Lab)...See more

Jacopo Iannacci (Senior Member of the IEEE) was born in Bologna, Italy in 1977. He received his MSc (Laurea) degree in electronics engineering in 2003 and his PhD in information and telecommunications technology in 2007, both from the University of Bologna, Italy. He received Habilitation as Full Professor in Electronics from the Italian Ministry of University and Research (MUR), in 2021. He worked in 2005 and 2006 as visiting researcher at the DIMES Technology Center (currently Else Kooi Lab) of the Technical University of Delft, the Netherlands, focusing on packaging and integration of RF-MEMS (radio frequency passives in MEMS technology). In 2016, he visited as seconded researcher the Fraunhofer Institute for Reliability and Microintegration IZM in Berlin, Germany, to conduct high-frequency characterization of RF-MEMS components. Since 2007, he has been a researcher (permanent staff) at the Center for Sensors & Devices of Fondazione Bruno Kessler in Trento, Italy. His research interests and experience fall in the areas of finite element method (FEM) multi-physics modelling, compact (analytical) modeling, design, optimization, integration, packaging, experimental characterization and testing for reliability of MEMS and RF-MEMS devices and networks for sensors and actuators, energy harvesting (EH-MEMS) and telecommunication systems, with applications in the fields of 5G, Internet of Things (IoT), as well as future 6G, Tactile Internet (TI) and Super-IoT. Dr. Iannacci has authored about 150 scientific contributions. He is currently associate editor of Springer Microsystem Technologies, and series editor of the IEEE Communications Magazine (ComMag). He has been involved in several international conferences as symposium chair/co-chair, session chair, technical program committee member, international advisory board member, tutorial lecturer and invited speaker. See less