Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, ...
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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires
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Add this copy of Three-Dimensional Integrated Circuit Design to cart. $122.44, new condition, Sold by Booksplease rated 4.0 out of 5 stars, ships from Southport, MERSEYSIDE, UNITED KINGDOM, published 2017 by Morgan Kaufmann Publishers.
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Add this copy of Three-Dimensional Integrated Circuit Design to cart. $168.83, new condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 2017 by Morgan Kaufmann.
Add this copy of Three-Dimensional Integrated Circuit Design to cart. $451.00, new condition, Sold by BG_Books rated 3.0 out of 5 stars, ships from CURITIBA, PARANA, BRAZIL, published 2017 by MORGAN KAUFMANN.
