Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of ...
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Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
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Add this copy of Thin Films Stresses and Mechanical Properties VI: 436 to cart. $17.00, good condition, Sold by The Book Bin rated 5.0 out of 5 stars, ships from Salem, OR, UNITED STATES, published 1996 by Materials Research Society.
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Good. Light shelf wear. Interior is clean. Hinge split at title page, binding and pages intact. Ex-company lib (HP), labels to front cover, lower spine, chargeout slip to FFEP. Year 1999. 542 p. Oversize/Overweight, No International shipping, No Expedited shipping. Standard shipping only.
