This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.
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This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.
Read Less
Add this copy of Thermal and Structural Electronic Packaging Analysis to cart. $58.23, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2024 by CRC Press.
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New. Trade paperback (US). Glued binding. 290 p. Contains: Unspecified, Illustrations, black & white, Halftones, black & white, Line drawings, black & white, Tables, black & white. Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems.
Add this copy of Thermal and Structural Electronic Packaging Analysis to cart. $73.37, new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2024 by CRC Press.
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New. Trade paperback (US). Glued binding. 290 p. Contains: Unspecified, Illustrations, black & white, Halftones, black & white, Line drawings, black & white, Tables, black & white. Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of Thermal and Structural Electronic Packaging Analysis to cart. $73.38, new condition, Sold by Ria Christie Books rated 5.0 out of 5 stars, ships from Uxbridge, MIDDLESEX, UNITED KINGDOM, published 2024 by CRC Press.
Add this copy of Thermal and Structural Electronic Packaging Analysis to cart. $73.44, new condition, Sold by Booksplease rated 4.0 out of 5 stars, ships from Southport, MERSEYSIDE, UNITED KINGDOM, published 2024 by CRC Press.
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New. Trade paperback (US). Glued binding. 290 p. Contains: Unspecified, Illustrations, black & white, Halftones, black & white, Line drawings, black & white, Tables, black & white. Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems.
Add this copy of Thermal and Structural Electronic Packaging Analysis to cart. $75.00, very good condition, Sold by Jero Books and Templet Co. rated 5.0 out of 5 stars, ships from Santa Monica, CA, UNITED STATES, published 2022 by CRC Press.
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Very Good. No DJ Issued. Engineering / Structural Space. 8vo. Signed 1st Edition (2022. ) 8vo paperback with 289 pages. Signed on the front free endpaper, "To Aunt Bonnie, Jeremiah Gayle." The book is in very good condition very slight shelf wear. Interior clean and tight. No online access or CD-ROM or digital access codes if applicable! "Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter." Black spine/White text.
