Welcome to ACM TEI 2019, the 13th International Conference on Tangible, Embedded and Embodied Interactions, hosted in Tempe, Arizona, United States, from the 17th to the 20th of March 2019. The TEI conference features top-tier work that addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. Over the past few years, TEI research has ...
Read More
Welcome to ACM TEI 2019, the 13th International Conference on Tangible, Embedded and Embodied Interactions, hosted in Tempe, Arizona, United States, from the 17th to the 20th of March 2019. The TEI conference features top-tier work that addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. Over the past few years, TEI research has increasingly embraced hybridity, whether through material explorations of composites such as bioelectronic, on-body, or active materials, or theoretical inquiries into socio-technical systems as hybrid assemblies. Not confined to a single approach, we have seen advancements in new materials-such as conductive and thermochromic inks, OLEDs, biosensors, or bioelectronics-which have helped to embed computing in the physical world. Simultaneously, comparisons between tangible computing and crafting traditions-such as crocheting or weaving-have served to destabilize assumptions about 'low' and 'high' technologies, the cultures that surround them, and even which communities have been able to participate in the discussion. These hybrid, materially-oriented approaches are radically changing our understanding of what tangible interaction looks and feels like. The theme of Hybrid Materials will continue to catalyze this exciting trend of tangible interaction research at the intersection of social, technical, biological, and artistic systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations and performances. TEI 2019 hosts a four-day program, starting on Sunday, March 17th with the Graduate Student Consortium and a series of five Studios that engage participants in the concrete making of novel interfaces and interactions. The main program starts on Monday, March 18th with an opening keynote by Dr. Batya Friedman, which sets out to inspire reflection and action on the TEI community's engagement with human values and material matters. The keynote us followed by a series of talks on Users with Abilities and Learning & Entertainment, followed by a hands-on session showcasing Work-in-Progress demonstrations as well as exemplar demos and posters of the full papers accepted to the proceedings. Tuesday, March 19th starts with an exhibit of Student Design Challenge submissions that speculate on how humans will interact with future digital, physical, biological, social, and virtual materials, as well as the Graduate Student Consortium poster session. This is followed by a paper talks session titled Matters Shape, Shape Matters. TEI is then hosting a Diversity and Inclusion Lunch, the first event of its kind at TEI. Organized by invited speaker Dr. Gopinaath Kannabiran, this event aims to 1) create and strengthen the diverse networks of our attendees and support mentorships across academia, research, and industry for those with traditionally marginalized backgrounds; and 2) reflect on current diversity/inclusion research and develop an agenda for future TEI work to explore previously under-studied diversity/inclusion themes. The afternoon features another hands-on session showcasing the remainder of the Work-in-Progress as well as demonstrations and posters of the full papers accepted to the proceedings.
Read Less
Add this copy of Tei'19: Proceedings of the Thirteenth International to cart. $223.58, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2020 by ACM.
Add this copy of Tei'19: Proceedings of the Thirteenth International to cart. $261.62, like new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2020 by ACM.
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
Fine. Trade paperback (US). Glued binding. 786 p. Contains: Unspecified. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of Tei'19: Proceedings of the Thirteenth International to cart. $261.87, new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2020 by ACM.
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
New. Trade paperback (US). Glued binding. 786 p. Contains: Unspecified. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
