One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech- nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo- dated. This is ...
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One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech- nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo- dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation- ships between these characteristics are clearly explained and pre- sented. In this excellent presentation, Dr. Hwang highlights three impor- tant areas of solder paste technology.
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Add this copy of Solder Paste in Electronics Packaging: Technology and to cart. $16.00, very good condition, Sold by Tiber Books rated 4.0 out of 5 stars, ships from Cockeysville, MD, UNITED STATES, published 1989 by Van Nostrand Reinhold, NY.
Add this copy of Solder Paste in Electronics Packaging: Technology and to cart. $17.88, very good condition, Sold by GuthrieBooks rated 5.0 out of 5 stars, ships from Spring Branch, TX, UNITED STATES, published 1989 by Van Nostrand Reinhold Company.
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Very Good. Size: 9x6x1; Ex-Library hardcover with dj in very nice condition with the usual markings and attachments. Except for library markings, interior clean and unmarked. Tight binding.
Add this copy of Solder Paste in Electronics Packaging: Technology and to cart. $17.88, good condition, Sold by Bookmans rated 4.0 out of 5 stars, ships from Tucson, AZ, UNITED STATES, published 1989 by Van Nostrand Reinhold Company.
Add this copy of Solder Paste in Electronics Packaging: Technology and to cart. $33.98, good condition, Sold by Goodwill of Silicon Valley rated 5.0 out of 5 stars, ships from San Jose, CA, UNITED STATES, published 1992 by Springer.
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Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can included some highlighting and writing page and cover creases as well as other types visible wear.
Add this copy of Solder Paste in Electronics Packaging: Technology and to cart. $43.00, very good condition, Sold by Clausen Books, RMABA rated 4.0 out of 5 stars, ships from Colorado Springs, CO, UNITED STATES, published 1981 by Van Nostrand Reinhold.
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Photographs/Graphs/Charts/Folded Maps/Rear Pocket Map. Very Good in Very Good (in mylar) jacket. Hardcover. 8vo-over 7¾"-9¾" tall. Textblock and binding is clean and tight. Unclipped dust jacket with light loss to extremities, some creases. 456p., including index.
Add this copy of Solder Paste in Electronics Packaging: Technology and to cart. $45.00, good condition, Sold by bookbooth rated 4.0 out of 5 stars, ships from Berea, OH, UNITED STATES, published 1992 by Van Nostrand Reinhold.
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Good. 6 x 9. Minor shelf wear and cover soil, corners lightly bumped, former owners name inside front cover, xxii + 456 pages including appendix and index, covers chemical and physical characteristics, metallurgy, rheology of pastes, soldering methods and application techniques, cleaning, reliability and quality control, testing and related topics, bw illustrations.
Add this copy of Solder Paste in Electronics Packaging: Technology and to cart. $49.78, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 1989 by Van Nostrand Reinhold Company.
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Add this copy of Solder Paste in Electronics Packaging: Technology and to cart. $51.64, new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2012 by Springer.
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New. Trade paperback (US). Glued binding. 456 p. Contains: Unspecified. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
