Dealing with BGA, CSP, flip chips and other new technologies that underlie the electronics industry's need for smaller, faster products, this text explains the fundamentals of solder joint reliability and presents creative, robust packaging techniques for cost-effective interconnection.
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Dealing with BGA, CSP, flip chips and other new technologies that underlie the electronics industry's need for smaller, faster products, this text explains the fundamentals of solder joint reliability and presents creative, robust packaging techniques for cost-effective interconnection.
Read Less
Add this copy of Solder Joint Reliability of BGA, CSP, Flip Chip, and to cart. $6.00, very good condition, Sold by Booksup rated 5.0 out of 5 stars, ships from Laguna Niguel, CA, UNITED STATES, published 1996 by McGraw-Hill Professional Publishing.
