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SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guide

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SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guide - Li (Li Yang), Suny
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An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package ...

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SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guide 2017, John Wiley & Sons Inc, New York

ISBN-13: 9781119045939

Hardcover