Unlike most available sources that focus on deep neural network (DNN) inference, this book provides readers with a single-source reference on the needs, requirements, and challenges involved with on-device, DNN training semiconductor and SoC design. The authors include coverage of the trends and history surrounding the development of on-device DNN training, as well as on-device training semiconductors and SoC design examples to facilitate understanding.
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Unlike most available sources that focus on deep neural network (DNN) inference, this book provides readers with a single-source reference on the needs, requirements, and challenges involved with on-device, DNN training semiconductor and SoC design. The authors include coverage of the trends and history surrounding the development of on-device DNN training, as well as on-device training semiconductors and SoC design examples to facilitate understanding.
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Add this copy of On-Chip Training Npu-Algorithm, Architecture and Soc to cart. $83.86, very good condition, Sold by Books From California rated 4.0 out of 5 stars, ships from Simi Valley, CA, UNITED STATES, published 2023 by Springer.
Add this copy of On-Chip Training Npu-Algorithm, Architecture and Soc to cart. $83.86, good condition, Sold by Books From California rated 4.0 out of 5 stars, ships from Simi Valley, CA, UNITED STATES, published 2023 by Springer.
Add this copy of On-Chip Training Npu Algorithm, Architecture and Soc to cart. $105.91, new condition, Sold by TextbookRush rated 4.0 out of 5 stars, ships from Grandview Hts, OH, UNITED STATES, published 2023 by Springer.
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Add this copy of On Chip Training Npu Algorithm Architecture and Soc to cart. $109.40, new condition, Sold by Books International rated 3.0 out of 5 stars, ships from Toronto, ON, CANADA, published 2023 by Springer.
Add this copy of On-Chip Training Npu-Algorithm, Architecture and Soc to cart. $125.78, good condition, Sold by Books From California rated 4.0 out of 5 stars, ships from Simi Valley, CA, UNITED STATES, published 2023 by Springer.