Covering the technology of the formation and packaging of microstructures for transducer applications, the papers in this book address isotropical and anisotropical etching of silicon and other materials by electrochemical, chemical and other techniques; and describe the adaptation of advanced integrated circuit technology and laser drilling to novel microstructures. Packaging considerations and materials (including various encapsulants, adhesives and specialty polymers) are emphasized to provide potentially high ...
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Covering the technology of the formation and packaging of microstructures for transducer applications, the papers in this book address isotropical and anisotropical etching of silicon and other materials by electrochemical, chemical and other techniques; and describe the adaptation of advanced integrated circuit technology and laser drilling to novel microstructures. Packaging considerations and materials (including various encapsulants, adhesives and specialty polymers) are emphasized to provide potentially high reliability transducer assemblies. The many application examples given include sensor structures and systems for chemical sensing, flow measurement, pressure measurement, enzyme reaction and other biomedical and industrial applications. Engineers and researchers in the industrial and academic community will value this book, as it describes the state of the art of machining and microsensor packaging, identifies existing techniques, will be useful when applying these techniques to other microstructures and devices.
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Add this copy of Micromachining and Micropackaging of Transducers to cart. $63.99, good condition, Sold by HPB-Red rated 5.0 out of 5 stars, ships from Dallas, TX, UNITED STATES, published 1986 by Elsevier Science Ltd.
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Add this copy of Micromachining and Micropackaging of Transducers to cart. $68.01, new condition, Sold by GridFreed rated 4.0 out of 5 stars, ships from North Las Vegas, NV, UNITED STATES, published 1986 by Elsevier Science Ltd.
