Add this copy of Iaeng Transactions on Engineering Technologies: Special to cart. $159.69, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2015 by Springer.
Add this copy of Iaeng Transactions on Engineering Technologies: Special to cart. $159.69, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2012 by Springer.
Add this copy of Iaeng Transactions on Engineering Technologies: Special to cart. $161.40, like new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2015 by Springer.
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Fine. Trade paperback (US). Glued binding. 386 p. Contains: Unspecified, Tables, black & white. Lecture Notes in Electrical Engineering, 186. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of Iaeng Transactions on Engineering Technologies: Special to cart. $161.65, new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2015 by Springer.
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
New. Trade paperback (US). Glued binding. 386 p. Contains: Unspecified, Tables, black & white. Lecture Notes in Electrical Engineering, 186. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
All Editions of Iaeng Transactions on Engineering Technologies: Special Issue of the International Multiconference of Engineers and Computer Scientists 2012
