This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays ...
Read More
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Read Less
Add this copy of High-Speed Vlsi Interconnections, 2nd Edition to cart. $61.79, new condition, Sold by discount_scientific_books rated 5.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 2007 by Wiley-IEEE Press.
Add this copy of High-Speed Vlsi Interconnections, 2nd Edition to cart. $64.59, new condition, Sold by discount_scientific_books rated 5.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 2007 by Wiley-IEEE Press.
Add this copy of High-Speed Vlsi Interconnections, 2nd Edition to cart. $64.59, new condition, Sold by discount_scientific_books rated 5.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES.
Add this copy of High-Speed VLSI Interconnections to cart. $158.14, new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2007 by Wiley-IEEE Press.
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
New. Sewn binding. Cloth over boards. 432 p. Contains: Illustrations. Wiley Microwave and Optical Engineering. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of High-Speed VLSI Interconnections to cart. $162.35, new condition, Sold by Booksplease rated 4.0 out of 5 stars, ships from Southport, MERSEYSIDE, UNITED KINGDOM, published 2007 by Wiley-IEEE Press.
Add this copy of High Speed Vlsi Interconnections to cart. $165.67, new condition, Sold by Kennys.ie rated 4.0 out of 5 stars, ships from Galway, IRELAND, published 2007 by Wiley-IEEE Press.
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
New. 2007. 2nd Revised edition. Hardcover. Updated to reflect the major developments in field of VLSI interconnections over the past decade, this Second Edition of High-Speed VLSI Interconnections includes new sections on Parasitic Inductances, Nanotechnology circuit interconnects, Electromigrations in the copper interconnections, and Optical Interconnections. Series: Wiley Series in Microwave and Optical Engineering. Num Pages: 432 pages, Illustrations. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 236 x 163 x 25. Weight in Grams: 730......We ship daily from our Bookshop.
