Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large ...
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Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
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Add this copy of Handbook of 3D Integration, Volume 3: 3D Process to cart. $161.09, new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2014 by Blackwell Verlag GmbH.
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Add this copy of Handbook of 3d Integration, Volume 3 to cart. $161.10, new condition, Sold by Ria Christie Books rated 5.0 out of 5 stars, ships from Uxbridge, MIDDLESEX, UNITED KINGDOM, published 2014 by Blackwell Verlag GmbH.
Add this copy of Handbook of 3d Integration, Volume 3: 3d Process to cart. $193.35, new condition, Sold by Kennys.ie rated 4.0 out of 5 stars, ships from Galway, IRELAND, published 2014 by Blackwell Verlag GmbH.
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New. Edited by key figures in the field and written by top authors from academia and industry, this book covers the intricate details of 3D process technology from both a technological and a materials science perspective. Editor(s): Garrou, Philip E.; Koyanagi, Mitsumasa; Ramm, Peter. Num Pages: 474 pages, illustrations (black and white, and colour). BIC Classification: TGM; TJFC; TJFD5. Category: (P) Professional & Vocational. Dimension: 251 x 176 x 29. Weight in Grams: 1168. 2014. 1st Edition. hardcover.....We ship daily from our Bookshop.
Add this copy of Handbook of 3D Integration, Volume 3: 3D Process to cart. $200.71, new condition, Sold by Booksplease rated 3.0 out of 5 stars, ships from Southport, MERSEYSIDE, UNITED KINGDOM, published 2014 by Blackwell Verlag GmbH.
