Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. THE MOST COMPREHENSIVE REFERENCE IN ELECTRONIC PACKAGING--COMPLETELY UPDATED From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics. ...
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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. THE MOST COMPREHENSIVE REFERENCE IN ELECTRONIC PACKAGING--COMPLETELY UPDATED From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic packaging, becoming the most widely used reference in the industry. This thoroughly revised and expanded Fourth Edition adds new information on key MEMs; optoelectronic, single-chip, and high-speed technologies; and updates important chapters on ball grid array and flip chip technologies. Of interest to mechanical and electrical engineers, chemists, physicists, and materials scientists in all areas of the electronic packaging industry, the book takes a unique interdisciplinary approach to the field, allowing specialists in one area to understand the needs and responsibilities of others. Whether your area of expertise is design and manufacturing, quality control, or marketing, it's easy to see why the Fourth Edition of the Electronic Packaging and Interconnection Handbook makes an excellent addition to your reference arsenal. Written by a team of experts from around the globe, this remarkable volume covers all aspects of electronic packaging, including: Materials Thermal Management Shock, Vibration, and Operational Stress Management Connector and Interconnection Technologies Soldering and Cleaning Technologies Single Chip Packaging and Ball Grid Arrays Surface Mount Technology Hybrid and Multichip Modules Chip-Scale, Flip-Chip, and Direct-Chip Attachment Rigid and Flexible Printed-Wiring Boards Packaging High-Speed and Microwave Systems Packaging High-Voltage Systems Packaging of MEMs Systems Packaging of Optoelectronic Systems
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Add this copy of Electronic Packaging and Interconnection Handbook 4/E to cart. $80.11, good condition, Sold by Goodwill of Orange County rated 5.0 out of 5 stars, ships from Santa Ana, CA, UNITED STATES, published 2004 by McGraw-Hill Companies.
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Book has internal/external wear and/or highlighting and underlining. It may have creases on the cover and some folded pages. This is a USED book. Codes have been used. All items ship Monday-Friday within 2-3 business days. Thank you for supporting Goodwill of OC.
Add this copy of Electronic Packaging and Interconnection Handbook 4/E to cart. $80.11, fair condition, Sold by ThriftBooks-Reno rated 4.0 out of 5 stars, ships from Reno, NV, UNITED STATES, published 2004 by McGraw-Hill Companies.
Add this copy of Electronic Packaging and Interconnection Handbook 4/E to cart. $80.31, very good condition, Sold by Academic Book Solutions rated 5.0 out of 5 stars, ships from Medford, NY, UNITED STATES, published 2004 by McGraw Hill.
Add this copy of Electronic Packaging and Interconnection Handbook 4/E to cart. $214.72, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2004 by McGraw-Hill Companies.
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Add this copy of Electronic Packaging and Interconnection Handbook 4/E to cart. $244.00, new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2004 by McGraw-Hill Companies.
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New. Sewn binding. Cloth over boards. 1000 p. Contains: Unspecified. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of Electronic Packaging and Interconnection Handbook 4/E to cart. $244.00, like new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2004 by McGraw-Hill Companies.
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Fine. Sewn binding. Cloth over boards. 1000 p. Contains: Unspecified. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
