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Electronic Packaging Science and Technology

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Electronic Packaging Science and Technology - Tu, King-Ning, and Chen, Chih, and Chen, Hung-Ming
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"This book focuses on modern technology and how electronic packaging plays a major role in moving technology forward. With the enhancement of mobile technology and its challenges, the need for packing technology solutions is evident. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu ...

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Electronic Packaging Science and Technology 2021, Wiley

ISBN-13: 9781119418313

Hardcover