This book was motivated by the problems being faced with shrinking IC process feature sizes. It is well known that as process feature sizes shrink, a host of electrical problems like cross-talk, electromigration, self-heat, etc. are becoming important. Cross-talk is one of the major problems since it results in unpredictable design behavior. In particular, it can result in significant delay variation or signal integrity problems in a wire, depending on the state of its neighboring wires. Typical approaches to tackle the ...
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This book was motivated by the problems being faced with shrinking IC process feature sizes. It is well known that as process feature sizes shrink, a host of electrical problems like cross-talk, electromigration, self-heat, etc. are becoming important. Cross-talk is one of the major problems since it results in unpredictable design behavior. In particular, it can result in significant delay variation or signal integrity problems in a wire, depending on the state of its neighboring wires. Typical approaches to tackle the cross-talk problem attempt to fix the problem once it is created. In our approach, we ensure that cross-talk is eliminated by design. The work described in this book attempts to take an "outside-the-box" view and propose a radically different design style. This design style first imposes a fixed layout pattern (or fabric) on the integrated circuit, and then embeds the circuit being implemented into this fabric. The fabric is chosen carefully in order to eliminate the cross-talk problem being faced in modem IC processes. With our choice of fabric, cross-talk between adjacent wires on an IC is reduced by between one and two orders of magnitude. In this way, the fabric concept eliminates cross-talk up-front, and by design. We propose two separate design flows, each of which uses the fabric concept to implement logic. The first flow uses fabric-compliant standard cells as an im- plementation vehicle. We call these cells fabric cells, and they have the same logic functionality as existing standard cells with which they are compared.
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Add this copy of Cross-Talk Noise Immune VLSI Design Using Regular to cart. $103.32, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2012 by Springer.
Add this copy of Cross-Talk Noise Immune VLSI Design Using Regular to cart. $103.32, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2001 by Springer.
Add this copy of Cross-Talk Noise Immune VLSI Design Using Regular to cart. $112.64, new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2012 by Springer.
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New. Trade paperback (US). Glued binding. 112 p. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
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New. Sewn binding. Cloth over boards. 112 p. Contains: Unspecified. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of Cross-Talk Noise Immune Vlsi Design Using Regular to cart. $119.69, new condition, Sold by GridFreed rated 4.0 out of 5 stars, ships from North Las Vegas, NV, UNITED STATES, published 2001 by Springer.