With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems. Readers will find: -- General overview of IC package reliability testing -- Characterization for the electrical performance of IC packages -- Understanding surface characteristics and ...
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With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems. Readers will find: -- General overview of IC package reliability testing -- Characterization for the electrical performance of IC packages -- Understanding surface characteristics and interfaces for thermal management -- Concise summaries of major characterization technologies for integrated circuit packaging materials, including acoustic microscopy, atomic absorption spectrometry, Auger Electron Spectroscopy, Energy-Dispersive X-Ray Spectroscopy, and many more.
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Add this copy of Characterization of Integrated Circuit Packaging to cart. $9.40, very good condition, Sold by Suffolk Books rated 5.0 out of 5 stars, ships from center moriches, NY, UNITED STATES, published 2010 by Momentum Press.
Add this copy of Characterization of Integrated Circuit Packaging to cart. $9.43, good condition, Sold by HPB-Red rated 5.0 out of 5 stars, ships from Dallas, TX, UNITED STATES, published 1993 by Newnes.
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Add this copy of Characterization of Integrated Circuit Packaging to cart. $9.89, good condition, Sold by Bookmans rated 4.0 out of 5 stars, ships from Tucson, AZ, UNITED STATES, published 2010 by Momentum Press.
Add this copy of Characterization of Integrated Circuit Packaging to cart. $52.96, like new condition, Sold by Rob the Book Man rated 4.0 out of 5 stars, ships from Vancouver, WA, UNITED STATES, published 1993 by Saint Louis, Missouri, U.S.A. : Butterworth-Heinemann.
Add this copy of Characterization of Integrated Circuit Packaging to cart. $67.04, very good condition, Sold by Hay-on-Wye Booksellers rated 4.0 out of 5 stars, ships from Hereford, UNITED KINGDOM, published 2010 by Momentum Press.
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Very Good. Some shelfwear to the extremities in places. Content is clean throughout. Sewn binding. Cloth over boards. 274 p. Contains: Tables, black & white, Figures. Materials Characterization.
Add this copy of Characterization of Integrated Circuit Packaging to cart. $82.03, fair condition, Sold by Books International rated 3.0 out of 5 stars, ships from Toronto, ON, CANADA, published 2010 by Momentum Press.
