Skip to main content alibris logo

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

by

Write The First Customer Review
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices - Suhir, Ephraim
Filter Results
Shipping
Item Condition
Seller Rating
Other Options
Change Currency

The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

loading
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices 2021, CRC Press, Oxford

ISBN-13: 9781138624733

Hardcover