This engineering reference covers new techniques in electronic packaging - flip chip, BGA, and MEMs. It includes high density packaging and cleaning options.
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This engineering reference covers new techniques in electronic packaging - flip chip, BGA, and MEMs. It includes high density packaging and cleaning options.
Read Less
Add this copy of Area Array Package Design: Techniques in High Density to cart. $74.83, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Newport Coast, CA, UNITED STATES, published 2003 by McGraw-Hill Professional.
