This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by ...
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This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
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Add this copy of Arbitrary Modeling of Tsvs for 3D Integrated Circuits to cart. $103.32, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2016 by Springer.
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New. Print on demand Trade paperback (US). Glued binding. 179 p. Contains: Unspecified, Illustrations, black & white, Illustrations, color, Tables, black & white, Tables, color. Analog Circuits and Signal Processing.
Add this copy of Arbitrary Modeling of Tsvs for 3D Integrated Circuits to cart. $116.87, like new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2016 by Springer.
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Fine. Trade paperback (US). Glued binding. 179 p. Contains: Unspecified, Illustrations, black & white, Illustrations, color, Tables, black & white, Tables, color. Analog Circuits and Signal Processing. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of Arbitrary Modeling of Tsvs for 3D Integrated Circuits to cart. $117.12, new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2016 by Springer.
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New. Trade paperback (US). Glued binding. 179 p. Contains: Unspecified, Illustrations, black & white, Illustrations, color, Tables, black & white, Tables, color. Analog Circuits and Signal Processing. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.