This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more.
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This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more.
Read Less
Add this copy of Advanced Materials for Thermal Management of Electronic to cart. $248.30, new condition, Sold by Booksplease rated 3.0 out of 5 stars, ships from Southport, MERSEYSIDE, UNITED KINGDOM, published 2013 by Springer.
Add this copy of Advanced Materials for Thermal Management of Electronic to cart. $263.02, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2013 by Springer.
Add this copy of Advanced Materials for Thermal Management of Electronic to cart. $263.02, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2011 by Springer.
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Seller's Description:
New. Print on demand Glued binding. Paper over boards. 618 p. Contains: Unspecified, Tables, black & white, Figures. Springer Advanced Microelectronics, 30.
Add this copy of Advanced Materials for Thermal Management of Electronic to cart. $345.09, new condition, Sold by Booksplease rated 3.0 out of 5 stars, ships from Southport, MERSEYSIDE, UNITED KINGDOM, published 2011 by Springer.
