Flip chip packaging is used in computing, communications, consumer and automotive electronics. This book discusses past, present and future advances in flip chip packaging, covering trends in substrate technology, material development and assembly processes.
Read More
Flip chip packaging is used in computing, communications, consumer and automotive electronics. This book discusses past, present and future advances in flip chip packaging, covering trends in substrate technology, material development and assembly processes.
Read Less
Add this copy of Advanced Flip Chip Packaging to cart. $206.66, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2013 by Springer.
